3M Scotch-Weld Epoxy Potting Compound DP270 Clear, 1.69 fl oz (Pack of 1)

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3M™ Scotch-Weld™ Epoxy Potting Compound DP270 Clear is a two-part, low viscosity, self leveling epoxy resin system designed primarily for potting, sealing, and encapsulation of many electronic components. It is non-corrosive to copper, non-exothermic and its low viscosity provides high flow rate, ideal for precise control when dispensing small amounts. It dries to a clear, amber color with very little shrinkage and its clarity allows visibility of the component. DP270 also protects the component from moisture and contaminants and is suitable for outdoor use. This adhesive provides structural strength and also bonds a wide variety of substrates including metals, ceramics, wood, and many plastics. This clear drying adhesive and potting compound begins with low viscosity for easy, controlled dispensing. The mix ratio is 1:1 and provides a 60 minute work life, which allows plenty of time to position and to adjust fit prior to setting. The adhesive reaches handling strength in approximately 3 hours and is fully cured in 48 hours (at 720F/220C). DP270 meets the requirements of UL 94 HB (Horizontal Burn). Both mixing nozzle and applicator are required for dispensing from the Duo-Pak cartridge and are sold separately. For best results, always use 3M™ Scotch-Weld™ EPX™ Plus II Applicator and Mixing Nozzles.Formula is ideal for potting and bonding electronic and electrical components
Non-exothermic reaction safeguards heat-sensitive components
Extended work-time allows for positioning and adjustment to fit prior to setting
Non-corrosiveness to copper preserves conductivity and retention of insulation properties
Effective adhesive system for potting, bonding, joining, gluing, attaching, assembling, encapsulating, and sealing applications

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